
Taiwan IC substrate firm Xinxing halts machinery after fatal accident
IC substrate manufacturer Xinxing has halted some machinery at its Yangmei plant following a fatal workplace accident, as ordered by the Taoyuan City Labor Inspection Office.
Thursday, October 15, 2026
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IC substrate manufacturer Xinxing has halted some machinery at its Yangmei plant following a fatal workplace accident, as ordered by the Taoyuan City Labor Inspection Office.

Lille suffered a 3-0 defeat to Arsenal in Champions League matchday 2, with Olivier Giroud making his return to his former club.

Broadcom's Frank Ostojic has urged semiconductor firms to collaborate on equipment, materials, and design to address bottlenecks in AI chip performance, citing die size, packaging, power delivery, and cooling as key constraints.
semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide.
Frank Ostojic, Broadcom executive

Semiconductor companies like Nvidia, Broadcom, and Qualcomm are now prioritizing data-center efficiency over single-chip speed due to memory bandwidth, chip interconnects, power use, and heat management constraints.

OpenAI is reportedly in early talks to acquire Trail of Bits, a cybersecurity research firm, as it expands its enterprise cybersecurity efforts.

Google has unveiled the Gemini 4 Argon, a next-generation AI agent designed to balance advanced capabilities with stringent safety standards.

A federal judge has extended the block on President Donald Trump's White House ban of CNN, MS NOW and Politico.

Pakistan has received its first liquefied natural gas (LNG) shipment of October, addressing concerns over gas supply interruptions affecting power generation.

Cisco is expanding its AI data center technology strategy to include cross-site networking, open network operating systems, and device management alongside high-bandwidth switch chips.

At Plug and Play Taiwan's Batch 4 Selection Day, 21 startups were selected by industry veterans from TSMC and MediaTek, showcasing Taiwan's emerging tech innovation.

LGD has canceled the planned sale of its automotive LCD module business at its Nanjing subsidiary, losing a potential KRW104.1 billion payment and delaying plans to improve production efficiency.

LG Electronics is reportedly collaborating with Bosch to develop automotive chiplets, aiming to enter the automotive semiconductor market.

Adani and Jabil are planning a 50:50 joint venture to manufacture AI data center hardware in India, aiming to boost local production of servers, racks, and cooling systems.

Taiwan's export growth is increasingly driven by high-value AI servers and more expensive memory chips, highlighting the global demand for artificial intelligence hardware and the risks of concentration in one sector.

Applied Materials CEO Gary Dickerson has emphasized that the AI computing race depends on both technology and manufacturing capacity, with chipmakers needing to advance multiple areas to stay competitive.
The contest for leadership in AI computing is being fought on two fronts-technology and manufacturing capacity.
Gary Dickerson, President and CEO of Applied Materials

Japanese semiconductor materials company TOK has completed a new facility at its Koriyama plant and plans further expansion to meet rising demand for photoresists.

CyberTAN Technology has sold its Hsinchu Science Park factory and auxiliary facilities for US$68 billion, signaling a shift towards higher-growth networking and AI infrastructure.

Hua Hong Group has entered into strategic agreements with four Chinese semiconductor equipment suppliers at the China Chip Exhibition in Shanghai, aiming to enhance domestic manufacturing technologies.

China's exports surged 36.3% year-on-year in September, significantly outpacing forecasts, while imports grew 31%, according to customs data.

Qualcomm is working to decrease the energy costs associated with edge AI, as devices like smartphones and cars face tighter power and cooling limitations compared to data centers.

China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of Samsung Electronics and SK Hynix.

Japan's digital technology innovation expo CEATEC 2026 opened on October 13 at Makuhari Messe in Chiba, featuring 821 companies and organizations from Japan and overseas to demonstrate Physical AI, smart infrastructure maintenance, and disaster-prevention simulations.

Pakistan have clinched the T20I series against Sri Lanka 2-1 with a win in the final match.

Iranian officials report increased attacks on ships to maintain high oil prices before the US midterms, according to Reuters.

Chinese scientists have created wafer-scale graphene quantum rectifiers capable of converting weak radio-frequency signals into DC electricity at room temperature without an external magnetic field, advancing the integration of wireless energy-harvesting devices into semiconductor manufacturing.

Indian semiconductor engineering services firm Tessolve has raised US$75 million from US-based Vector Line Capital to fund multiple acquisitions over the next couple of quarters.

China is set to reduce export tax rebates for new energy vehicles, which could impact global auto markets and increase pressure on low-cost exporters.

SEMI has signed a three-year agreement with Phoenix, Arizona, to host SEMICON West in 2027, moving the exhibition from its traditional summer schedule to a spring event.

MiTAC Computing Technology presented a range of full-stack AI infrastructure solutions at the Open Compute Project Global Summit, focusing on liquid-cooled servers and open platforms.

China will reduce its export tax rebate for new energy vehicles (NEVs) from 13% to 9% starting April 1, 2027, increasing cost pressure on automakers, especially those selling lower-priced models.