During its July 16 earnings conference, TSMC stated that its Chip-on-Wafer-On-Substrate (CoWoS) capacity remains 'extremely tight' despite increased demand for AI technology.
'TSMC's CoWoS capacity remains 'extremely tight' and welcomed the emergence of additional advanced packaging solutions to help customers alleviate backend manufacturing bottlenecks.'
C.C. Wei, Chairman and CEO, TSMC





